capillary features and high reported on-axis conductivity, vertically oriented Carbon Nanotubes (CNTs) were explored as a candidate nanowick material. Early in the TGP effort we demonstrated that CNTs (which are naturally hydrophobic) can be rendered hydrophilic through application of an evaporated, conformal Cu coating. However, we also found that the low permeability of CNTs overwhelms the increased capillary pumping, limiting their use to very small evaporator areas [5]. To overcome this limitation, several bi-porous wick design approaches involving selective CNT growth on patterned conventional sintered wick materials were analyzed, with results pointing to significant opportunities to reduce the evaporative resistance [6]. Experimental investigations were undertaken to determine whether these predicted benefits could be realized. While results indicated that
24
Electronics COOLING March 2012
some potential enhancement could be achieved in the boiling regime [2], the predicted evaporative benefits proved difficult to quantify due to unforeseen (and beneficial) effects of CNT functionalization on heat transfer regime. In wicks functionalized with CNTs, we observed a significant decrease in the incipient wall superheat (peak temperature on the evaporator surface minus the vapor temperature) required to initiate boiling within the wick [7]. While CNTs had been demonstrated to reduce incipient superheat in pool boiling from flat surfaces [8], to our knowledge, this was the first conclusive demonstration of such a reduction in sintered Cu powder wicks. Moreover, we observed that the CNTs reduced the variability inherent to boiling incipience relative to that observed in sintered powder wicks without CNTs (Figure 3). As such, CNTs provide a means to ensure that the wicks would
operate in the boiling regime at lower heat inputs and at lower temperatures than they otherwise would without CNTs (Figure 5). This is a subtle but significant benefit. As shown in Figure 5, the transition from evaporation to boiling heat transfer within the TGP corresponds to a significant improvement in performance.
Cu Foam Wick Structures
State of the art (SoA) Cu powder-based wick structures are typically fabricated by sintering relatively large Cu particles (10s to 100s of microns) in a mold. Particle size and sintering conditions determine wick characteristics (i.e., effective pore radius, permeability, porosity), which largely determine TGP thermal resistance and transport capacity. We found that in thin (~1mm) vapor chambers, the vapor phase pressure drop can become a significant limitation for transport capacity [9].
2012
BUYERS' GUIDE
PRODUCTS & SERVICES INDEX Adhesives 3M Electronics Markets Materials Division Arlon Diemat Inc. Dow Corning Corporation DYMAX Corporation Ellsworth Adhesives Henkel Insulfab ResinLab Advanced Materials Element Six Indium Corporation Minteq International, Inc. Mintres BV Momentive Performance Materials Rogers Corporation sp3 Diamond Technologies Inc. Spectra-Mat Inc. Stablcor Surmet Corporation Taica Corporation Thermacore Inc. Air Conditioners Aqua Product Company Aspen Systems Inc. Caliente, LLC Ice Qube, Inc. ITW Vortec MovinCool Pfannenberg Rittal Corporation Air Filters Universal Air Filter Company AISiC Component CPS Technologies MC-21 Inc. Rogers Corporation Baseplates CPS Technologies MC-21 Inc. Spectra-Mat Inc. Wolverine Tube Inc. - MicroCool Division Blower/Fan Accessories Caliente, LLC Cooltron Industrial Supply EAO Ltd. Elma Electronic, Inc. Gardtec Incorporated Mechatronics ORION Fans Qualtek Electronics Corp. SEPA EUROPE GmbH STEGO, Inc. Universal Air Filter Company
Blowers Allied International Amerigon AMETEK Rotron Ashland Electric Products Inc. EAO Ltd. ebm-papst Inc. Jaro Thermal JMC Products Nidec America Corporation NMB Technologies Nuventix OLC Inc. Sanyo Denki America Inc. SEPA EUROPE GmbH SUNON Inc. Waypoint Thermal Management, Inc. Bonding DYMAX Corporation Chillers AMS Technologies Aqua Product Company Lytron Pfannenberg Circuit Assembly Materials Indium Corporation Nexlogic Technologies Inc. SinkPAD Corporation Cold Plates Advanced Thermal & Environmental Concepts (ATEC) AMS Technologies Aspen Systems Inc. Delta Engineers J. Kittredge Lytron Malico Inc. MaxQ Technology LLC Minteq International, Inc. Momentive Performance Materials Niagara Thermal Products Parker Hannifin Corporation Parker Precision Coolling Systems Division Sapa Extrusions - North America Smart Heatsinks SNS Cooling Technology Inc. Summit Thermal System Co., Ltd. Thermacore Inc. Thermshield LLC Vette Corp. Wakefield Solutions Wolverine Tube Inc. - MicroCool Division
Find updated listings at www.electronics-cooling.com
The Products & Services Index contains nearly 50 categories to help you find the equipment, components, and services you need. Details of all the suppliers listed within each category can be found in the Company Directory, starting on page 38. To learn how to be included in this directory, please e-mail editor@electronics-cooling.com. Composites Material Innovations Inc. (MII) Spectra-Mat Inc. Stablcor Connectors Colder Products Company LCR Electronics Parker Hannifin Corporation Connectors, Cable Amphenol Industrial Operations Aries Electronics Indium Corporation Staubli Corporation Coolers Alpha Novatech Inc. APACK Inc. Caliente, LLC Deepcool Industries Co. Ltd Delta Engineers Dynatron Corporation EXAIR Corporation ITW Vortec MovinCool Nextreme Thermal Solutions TE Technology Inc. Vette Corp. Zalman Tech Co., Ltd. Cooling System Compressors Parker Precision Cooling Systems Division Couplings Colder Products Company Staubli Corporation Education Courses/Seminars AERO NAV Laboratories Biber Thermal Design Cradle Future Facilities Inc. Package Science Services LLC Thermal Engineering Associates, Inc. Enclosures Aitech Defense Systems Chatsworth Products, Inc. Curtiss-Wright Controls Electronic Systems Elma Electronic, Inc. Extreme Engineering Solutions J. Kittredge Material Innovations Inc. (MII) MEN Micro, Inc. Rittal Corporation Youthen Technology Co., Ltd. Epoxy Diemat Inc. Timtronics
Electronics COOLING
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Electronics COOLING 2012 Buyers' Guide: Products & Services Index Fan Controllers Ashland Electric Products Inc. DegreeC, Degree Controls Inc. Fan Filters Cooltron Industrial Supply Gardtec incorporated Ice Qube, Inc. Pfannenberg Qualtek Electronics Corp. STEGO, Inc. Universal Air Filter Company
Fan Trays AMETEK Rotron EAO Ltd. ebm-papst Inc. Gardtec Incorporated Mechatronics Nidec America Corporation NMB Technologies ORION Fans Sanyo Denki America Inc. STEGO, Inc. Verotec Inc. Waypoint Thermal Management, Inc.
Fans ALLIED International AMETEK Rotron Ashland Electric Products Inc. Cofan USA Cooltron Industrial Supply Deepcool Industries Co. Ltd Dynatron Corporation EAO Ltd. ebm-papst Inc. Jaro Thermal JMC Products Mechatronics Nidec America Corporation NMB Technologies Nuventix OLC Inc. ORION Fans Pfannenberg Inc. Qualtek Electronics Corp. Rittal Corporation Sanyo Denki America Inc. SEPA EUROPE GmbH STEGO, Inc. SUNON Inc. Verotec Inc. Waypoint Thermal Management, Inc. Zalman Tech Co., Ltd. Flip Chip Underfill Henkel Gap Pads & Fillers AIM Specialty Materials Alfatec GmbH & Co. AOS Thermal Compounds Aqua Product Company The Bergquist Company Brady Corporation Caliente, LLC Cool Polymers Inc. Fujipoly Insulfab Intermark USA Laird Technologies
36
Electronics COOLING March 2012
Stockwell Elastomerics Inc. Timtronics Heat Exchangers AMETEK Rotron Caliente LLC Curtiss-Wright Controls Electronic Systems Flometrics Inc. Heatron, Inc. Ice Qube, Inc. Lytron Niagara Thermal Products Rittal Corporation Thermacore Inc. Heat Pipes Advanced Cooling Technologies Inc. APACK Inc. Baknor Caliente, LLC Celsia Technologies Concept Group Inc. Delta Engineers Enertron Inc. Mersen Sapa Extrusions - North America Thermacore Inc. Thermshield LLC TTM Co., Ltd. Heat Sinks Alpha Novatech Inc. APACK Inc. Baknor Caliente, LLC Cinch Connectors Cofan USA Cool Polymers Inc. Deepcool Industries Co. Ltd Dynatron Corporation Element Six Enertron Inc. Fischer Elektronik GmbH & Co. KG Graftech International Heatron, Inc. Intermark USA Jaro Thermal Malico Inc. MaxQ Technology LLC Mersen Minteq International, Inc. Niagara Thermal Products Nuventix OLC Inc. Radian Heatsinks Sapa Extrusions - North America Seifert Electronic GmbH & Co. KG Singapore Institute of Manufacturing Technology SinkPAD Corporation Smart Heatsinks SNS Cooling Technology Inc. Spectra-Mat Inc. Summit Thermal System Co., Ltd. Thermacore, Inc. Thermal Solution Resources, LLC Thermshield LLC
Is your company missing? Send your information to Sarah Long at editor@electronics-cooling.com
Wakefield Solutions Youthen Technology Co., Ltd. Heat Spreaders 3M Electronics Markets Materials Division Advanced Cooling Technologies Inc. Caliente, LLC Celsia Technologies CPS Technologies Deepcool Industries Co. Ltd Graftech International Intermark USA MC-21 Inc. Minteq International, Inc. Mintres BV Momentive Performance Materials Rogers Corporation SinkPAD Corporation sp3 Diamond Technologies Inc. Spectra-Mat Inc. Stablcor Surmet Corporation Thermacore Inc. Heaters Caliente, LLC Infrared Imaging FLIR Commercial Systems, Inc. OptoTherm Inc. Palmer Wahl Temperature Instruments Interface Materials AIM Specialty Materials Alfatec GmbH & Co. AOS Thermal Compounds Arlon The Bergquist Company Brady Corporation Dow Corning Corporation DYMAX Corporation Ellsworth Adhesives Enerdyne Solutions Fujipoly Graftech International Henkel Indium Corporation Intermark USA MH&W International Corp. Minteq International, Inc. Plansee SE ResinLab Rogers Corporation Schlegel Electronic Materials ShinEtsu MicroSi Stockwell Elastomerics Inc. Timtronics Laboratories, Test & Research AERO NAV Laboratories Anter Corporation Material Innovations Inc. (MII) Package Science Services LLC Liquid Cooling Advanced Thermal & Environmental Concepts (ATEC) Aspen Systems Inc. Baknor Colder Products Company CoolIT Systems Inc. Curtiss-Wright Controls Electronic Systems Elma Electronic, Inc.
electronics-cooling.com March 2012 Flometrics Inc. J. Kittredge Malico Inc. MaxQ Technology LLC Mersen Niagara Thermal Products Parker Hannifin Corporation Parker Precision Coolling Systems Division Rittal Corporation SNS Cooling Technology Inc. Staubli Corporation Summit Thermal System Co., Ltd. Thermacore Inc. Thermshield Vette Corp. Wolverine Tube Inc. - MicroCool Division Passive Air Cooling Chatsworth Products, Inc. Deepcool Industries Co. Ltd Elma Electronic, Inc. Radian Heatsinks Singapore Institute of Manufacturing Technology SUNON Inc. Phase Change Materials AIM Specialty Materials Alfatec GmbH & Co. The Bergquist Company Brady Corporation Caliente, LLC Fujipoly Henkel Indium Corporation Intermark USA Laird Technologies MH&W International Corp. TTM Co., Ltd. Sensors, Test & Measurements Caliente, LLC DegreeC, Degree Controls Inc. FLIR Commercial Systems, Inc. Microsanj LLC Nextreme Thermal Solutions OptoTherm Inc. Palmer Wahl Temperature Instruments Sensor Products Inc. Spectrum Sensors Temperature@lert Thermal Engineering Associates Services AERO NAV Laboratories Cradle Daat Research Corp. Mechanical Solutions Inc. Microsanj LLC Nexlogic Technologies Inc. sp3 Diamond Technologies Inc. TES International LLC Software (Simulation) A.J. Wishart CapeSym Inc. Cradle Daat Research Corp. Future Facilities Inc. Harley Thermal LLC INTEGRATED Engineering Software Mechanical Solutions Inc. Mentor Graphics Corporation
TES International LLC Thermal Solutions Inc. Software (Thermal) Harley Thermal LLC Substrates The Bergquist Company Element Six Minteq International, Inc. Rogers Corporation SinkPAD Corporation Spectra-Mat Inc. Temperature Controllers Caliente LLC Concept Group Inc. CoolIT Systems Inc. DegreeC, Degree Controls Inc. EXAIR Corporation STEGO, Inc. Temperature@lert Verotec Inc. Test Equipment Anter Corporation Indium Corporation Microsanj LLC Palmer Wahl Temperature Instruments Sensor Products Inc. Teseq Thermal Engineering Associates Inc. Thermal Compounds AOS Thermal Compounds Arlon Diemat Inc. Dow Corning Corporation Ellsworth Adhesives Indium Corporation Intermark USA ResinLab Surmet Corporation Timtronics TTM Co., Ltd. Zalman Tech Co., Ltd. Thermal Design Services Advanced Thermal & Environmental Concepts (ATEC) Alpha Novatech Inc. AMS Technologies Biber Thermal Design CapeSym Inc. Chatsworth Products, Inc. Cofan USA Concept Group Inc. CoolIT Systems Inc. Daat Research Corp Enerdyne Solutions Future Facilities Inc. Harley Thermal LLC Heatron, Inc. JMC Products Mechanical Solutions Inc. Mentor Graphics Corporation Mintres BV Package Science Services LLC Smart Heatsinks TES International LLC Thermacore, Inc. Thermal Engineering Associates Inc.
Thermal Solution Resources, LLC Wakefield Solutions Thermal Tapes 3M Electronics Markets Materials Division Alpha Novatech Inc. The Bergquist Company Insulfab Intermark USA MH&W International Corp. ShinEtsu MicroSi Stockwell Elastomerics Inc. Thermal Test Chips Thermal Engineering Associates Thermal Testing Alpha Novatech Inc. Anter Corporation Enerdyne Solutions Enertron Inc. FLIR Commercial Systems, Inc. Indium Corporation Mentor Graphics Corporation OptoTherm Inc. Radian Heatsinks Singapore Institute of Manufacturing Technology Spectrum Sensors Taica Corporation Thermacore, Inc. Thermal Engineering Associates Inc. Thermally Conductive Graphite Fibers Minteq International, Inc. Taica Corporation Thermacore Inc. Thermally Conductive Molding Comp/Fillers Cool Polymers Inc. RTP Company ShinEtsu MicroSi Thermal Solution Resources, LLC Thermoelectric Coolers Amerigon Caliente LLC Laird Technologies Micropelt GmbH Nextreme Thermal Solutions Rittal Corporation SCTB NORD TE Technology Inc. Thermoelectric Module Controllers Amerigon Caliente LLC Micropelt GmbH TE Technology Inc. Vapor Chambers Advanced Cooling Technologies Inc. Celsia Technologies Thermacore Inc. Vortex Tube Coolers EXAIR Corporation Flometrics Inc. ITW Vortec Rittal Corporation Wind Tunnels Thermal Engineering Associates, Inc.
Electronics COOLING
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2012
BUYERS' GUIDE
Manufacturers, consultants and service organizations active in the thermal management field are listed in this directory. The listings of advertisers in this issue are marked with the page numbers of their advertisements. To learn how to be included in this directory, please e-mail info@electronics-cooling.com.
COMPANY DIRECTORY 0-9 3M Electronics Markets Materials Division
Aries Electronics
Cooltron Industrial Supply
Bristol, Pa., USA; 215-781-9956; www.arieselec.com
Walnut, Calif., USA; 909-598-6033; www.cooltron.com
CPS Technologies
St. Paul, Minn., USA; 866-599-4227; www.3m.com/electronics
A
Norton, Mass., USA; 508-222-0614, ext. 210; www.alsic.com
Arlon
A.J. Wishart Victoria, Australia; +61 3 9419 4438; www.awdabpt.com.au
Advanced Cooling Technologies, Inc. Lancaster, Pa., USA; 717-295-6080; www.1-ACT.com
Advanced Thermal & Environmental Concepts College Park, Md., USA; 301-699-1024; www.atec-ahx.com
AERO NAV Laboratories College Point, N.Y., USA; 718-939-4422; www.aeronavlabs.com
AIM Specialty Materials Cranston, R.I., USA; 401-463-5605; www.aimspecialty.com
1100 Governor Lea Road, Bear, DE 19701 USA; 302-834-2100; Fax: 302-834-2100; David Timpe, dtimpe@arlon-std.com, www.arlon-thermal.com
Ashland Electric Products, Inc. Rochester, N.H., USA; 603-335-1100; www.ashlandelectric.com
Aspen Systems, Inc. Marlborough, Mass., USA; 508-481-5058; http://aspensystems.com
B
Aitech Defense Systems
Baknor
Chatsworth, Calif., USA; 888-248-3248; Fax: 818-718-9787; www.rugged.com
The Bergquist Company.............. inside front cover
Alfatec GmbH & Co. - Kerafol Rednitzhembach, Germany; +49-9122-9796-0; www.alfatec.de
Allied International Bedford Hills, N.Y., USA; 914-241-6900; alliedinter.com
Ontario, Canada; 905-624-1800; www.baknor.com 18930 West 78th St., Chanhassen, MN 55317 USA; 952-4866359; Fax: 952-835-0430; Torry Skurski, torrys@bergquist company.com; www.bergquistcompany.com
Biber Thermal Design Portland, Ore., USA; 503-892-3771; www.biberthermal.com
Brady Corporation Alpha Novatech, Inc.................... inside back cover 473 Sapena Ct. #12, Santa Clara, CA 95054 USA; 408-5678082; Fax: 408-567-8053; Glenn Summerfield, glenn@alphanovatech.com; www.alphanovatech.com
Amerigon
Milwaukee, Wis., USA; www.bradydiecut.com/thermal
C
Cradle Beavercreek, Ohio, USA; 937-912-5798; www.cradle-cfd.com
Curtiss-Wright Controls Electronic Systems Littleton, Mass., USA; 978-952-2017; www.cwcelectronicsystems.com
D Daat Research Corp. Hanover, N.H., USA; 603-643-2999; www.daat.com
Deepcool Industries Co............................................ 17 International Science Park, Haidian District, Beijing, 100085 China; +86 10 82896517; Fax: +86 10 82826427; export@deepcooltech.com; www.deepcooltech.com
DegreeC, Degree Controls, Inc. Milford, N.H., USA; 877-DegreeC; www.degreec.com
Delta Engineers Sunset Beach, Calif., USA; 714-840-9673; www.delta.com
Device Technologies, Inc. Southborough, Mass., USA; 508-229-2000; www.devicetech.com
Diemat, Inc. Byfield, Mass., USA; 978-499-0900; www.diemat.com
Dow Corning Corporation Midland, Mich., USA; 800-637-5377; www.dowcorning.com/ electronics
DYMAX Corporation
Northville, Mich., USA; 248-504-0470; www.amerigon.com
Caliente LLC
Torrington, Conn., USA; 860-482-1010; www.dymax.com
AMETEK Rotron..........................................................33
1501 E. Berry St., Fort Wayne, IN 46803 USA; 260-426-3800; Fax: 260-426-3838; Mike Kelly, mike@heatsmarter.com; www.heatsmarter.com
Fremont, Calif., USA; 510-498-8888; www.dynatron-corp.com
55 Hasbrouck Lane, Woodstock, NY 12498 USA; 845-6792401; milinquiry@ametek.com; www.ametekaerodefense.com
Amphenol Industrial Operations Sidney, N.Y., USA; 215-781-9956; www.amphenol-industrial.com
AMS Technologies Bavaria, Germany; +49 (0) 89-895-77 0; www.amstechnologies.com
Anter Corporation Pittsburgh, Pa., USA; 412-795-6410; www.anter.com
AOS Thermal Compounds 22 Meridian Road #6, Eatontown, NJ 7724 USA; 732-389-5514; Fax: 732-389-6380; Lesley Maddalena, sales@aosco.com, www.aosco.com
APACK, Inc. Daejeon, Republic of Korea; +82-42-864-0815; www.apack.net
Aqua Product Company Prosperity, S.C., USA; 800-849-4264; www.aquaproductscompany.com
Is your company missing? Send your information to Sarah Long at editor@electronics-cooling.com
CapeSym, Inc. Natick, Mass., USA; 508-653-7100; www.capesym.com
Celsia Technologies Morgan Hill, Calif., USA; 408-577-1407; www.celsiatechnologies.com
Chatsworth Products, Inc.
Electronics COOLING March 2012
E EAO Ltd. West Sussex, United Kingdom; +01444 236000; www.eao.co.uk/fans
ebm-papst, Inc.......................................... back cover
Westlake Village, Calif., USA; 800-834-4969; www.chatsworth.com
100 Hyde Road, Farmington, CT 06034 USA; 860-674-1515; Fax: 860-674-8536; Marketing@us.ebmpapst.com; www.ebmpapst.us
Cinch Connectors
Element Six
Lombard, Ill., USA; 630-705-6000; www.cinch.com
Cofan USA.....................................................................32 46177 Warm Springs Blvd, Fremont, CA 94539 USA; 800-7666097; Fax: 510-490-7931; info@cofan-usa.com; www.cofan-usa.com
Colder Products Company St. Paul, Minn., USA; 651-645-0091; www.colder.com
Concept Group, Inc.....................................................24 380 Cooper Road, West Berlin, NJ 08091-9195 USA; 800424-7325; Fax: 856-768-3981; William E. Thomas, applica tions@conceptgroupinc.com; www.conceptgroupinc.com
Cool Polymers, Inc. North Kingstown, R.I., USA; 401-667-7830; www.coolpolymers.com
CoolIT Systems Inc. Alberta, Canada; 403-235-4895; www.coolitsystems.com
38
Dynatron Corporation
Santa Clara, Calif., USA; 408-986-2400; www.e6.com
Ellsworth Adhesives Germantown, Wis., USA; 800-888-0698; www.ellsworth.com
Elma Electronic Inc. Fremont, Calif., USA; 510-656-3400; www.elma.com
Enerdyne Solutions North Bend, Wash., USA; 425-888-1880; www.enerdynesolutions.com
Enertron, Inc. Tempe, Ariz., USA; 480-649-5400; enertron-inc.com
EXAIR Corporation Cincinnati, Ohio, USA; 513-671-3322; www.EXAIR.com
Extreme Engineering Solutions Middleton, Wis., USA; 608-833-1155; www.xes-inc.com
Electronics COOLING 2012 Buyers' Guide: Company Directory
F Fischer Elektronik GmbH & Co. KG .......................30 Postfach 15 90, D-58465 Ludenscheid, Germany; +49 (0) 23 51 4 35-0; Fax: +49 (0) 23 51 4 57 54; www.fischerelektronik.de
FLIR Commercial Systems, Inc...............................16 27700A SW Parkway Ave., Wilsonville, OR 97070 USA; 866-477-3687; info@sales.com; www.flir.com
Flometrics, Inc. Carlsbad, Calif., USA; 760-476-2770, ext. 505; www.flometrics.com
Fujipoly America Corp..............................................31 900 Milik St., P.O. Box 119, Carteret, NJ 07008 USA; 732-969-0100; Fax: 732-969-3311; info@fujipoly.com; www.fujipoly.com
Jaro Thermal
Nidec America Corporation
Boca Raton, Fla., USA; 561-241-6700, ext. 322; www.jarothermal.com
Braintree, Mass., USA; 781-848-0970; www.nidec.com
JMC Products
9730 Independence Ave., Chatsworth, CA 91311 USA; fans@nmbtc.com; www.nmbtc.com
Austin, Texas, USA; 512-834-8866; www.jmcproducts.com
L Laird Technologies Chesterfield, Mo., USA; 636-898-6048; www.lairdtech.com
LCR Electronics Norristown, Pa., USA; 610-278-0840; www.lcr-inc.com
Lytron Woburn, Mass., USA; 781-933-7300; www.lytron.com
M Malico Inc.......................................................................9 Malico..............................................................................9
Future Facilities Inc...................................................27 2055 Gateway Place #110, San Jose, CA 95110 USA; 408436-7701; Fax: 408-436-7705; Sherman Ikemoto, sher man.ikemoto@futurefacilities.com; www.futurefacilities.com
G Gardtec Incorporated Racine, Wis., USA; 262-645-5560; www.gardtecinc.com
Graftech International Lakewood, Ohio, USA; 216-676-2173; www.egraf.com
H
No. 5, Ming Lung Road, Yangmei 32663, Taiwan; +886-34728155, ext. 1616; Fax: 886-3-4725979; inquiry@malico. com.tw; www.malico.com.tw
Heatron, Inc. Leavenworth, Kan., USA; 913-651-4420; www.heatron.com
Henkel Irvine, Calif., USA; 714-368-8000; www.henkel.com/ electronics
I Ice Qube, Inc. Greensburg, Pa., USA; 724-837-7600; www.iceqube.com
Indium Corporation Clinton, N.Y., USA; 800-4-INDIUM; www.indium.com
Insulfab Coppell, Texas, USA; 800-442-1338; www.insulfab.net
INTEGRATED Engineering Software Manitoba, Canada; 204-632-5636; www.integratedsoft.com
Intermark USA.............................................................27 1310 Tully Road, Ste. 117, San Jose, CA 95122 USA; 408-9712055; Fax: 408-971-6033; sales@intermark-usa.com; www.intermark-usa.com
Austin, Texas, USA; 512-382-8100; www.nuventix.com
O OLC Inc. Pleasanton, Calif., USA; 408-921-9688; www.olc-inc.com
OptoTherm, Inc. Sewickley, Pa., USA; 724-940-7600; www.optotherm.com
ORION Fans Dallas, Texas, USA; 214-340-0265; www.orionfans.com
P Package Science Services LLC Santa Clara, Calif., USA; 408-969-2388; www.pkgscience.com
Palmer Wahl Temperature Instruments
Huntington Beach, Calif., USA; 714-373-3070; www.matinnovations.com
Parker Hannifin Corporation
MaxQ Technology, LLC Tempe, Ariz., USA; 877-804-0284; www.maxqtechnology.com
MC-21, Inc. Carson City, Nev., USA; 775-841-7112; www.mc21inc.com
Mechanical Solutions Inc Portland, Ore., USA; 503-384-2965; www.msthermal.com
Mechatronics MEN Micro, Inc.
6481 Long Island Road, Yonges Island, SC 29449 USA; 843-564-1229; David Rosato, dave@harleythermal.com; www.SolariaThermal.com
Nuventix
Material Innovations Inc (MII)
Preston, Wash., USA; 425-222-5900; www.mechatronics.com
Harley Thermal LLC.................................................... 18
NMB Technologies.....................................................13
Ambler, Pa., USA; 215-542-9575; www.menmicro.com
Mentor Graphics Corporation ................................29 Mechanical Analysis Division, 300 Nickerson Road, Marlborough, MA 01752 USA; 800-547-3000; Sharon Shepard, mad_info@mentor.com; www.mentor.com/mechanical
Mersen Ontario, Canada; 905-795-0077, ext. 247; www.us-ferrazshawmut.mersen.com/thermal
MH&W International Corp. Mahwah, N.J., USA; 201-891-8800; www.mhw-thermal.com
Micropelt GmbH Freiburg, Germany; +49 761 1563370; www.micropelt.com
Microsanj LLC Santa Clara, Calif., USA; 408-256-1255; www.microsanj.com
Minteq International, Inc. Easton, Pa., USA; 610-250-3398; www.pyrographite.com
Mintres BV....................................................................10 De Nieuwe Erven 8, Cuijk, 5431 NT, The Netherlands; + 31 485 396362; Fax: + 31 485 396377; Dr Xiao Tang, xiao.tang@mintres.com; www.mintres.com
Momentive Performance Materials Strongsville, Ohio, USA; 440-878-5685; www.momentive.com
MovinCool Long Beach, Calif., USA; 800-264-9573; www.movincool.com
Asheville, N.C., USA; 828-658-3131; www.palmerwahl.com New Haven, Ind., USA; 260-255-5108; www.powersystemscooling.com
Parker Precision Cooling Systems Division New Haven, Ind., USA; 509-552-5112; www.parkerprecisioncooling.com
Pfannenberg Lancaster, N.Y., USA; 716-685-6866; www.pfannenbergusa.com
Plansee SE .....................................................................7 6600 Reutte, Austria; thermalmanagement@plansee.com; www.plansee.com
Q Qualtek Electronics Corp. Mentor, Ohio, USA; 440-951-3300; www.qualtekusa.com
R Radian Heatsinks Santa Clara, Calif., USA; 408-988-6200; www.radianheatsinks.com
ResinLab Germantown, Wis., USA; 262-502-6610; www.resinlab.com
Rittal Corporation 1 Rittal Place, Urbana, OH 43078 USA; 800-477-4000; Fax: 937-390-5599; www.rittal-corp.com
Rogers Corporation Chandler, Ariz., USA; 480-917-6137; www.rogerscorporation.com
RTP Company Winona, Minn., USA; 507-454-6900; www.rtpcompany.com
S Sanyo Denki America Inc Torrance, Calif., USA; 310-783-5456; www.sanyo-denki.com
N N ITEM Media.....................................................15, 21, 34
Nexlogic Technologies, Inc.
1000 Germantown Pike, F-2, Plymouth Meeting, PA 19462 USA; 484-688-0300: Fax 484-688-0303; Paul Salotto, psal otto@electronics-cooling.com; www.electronics-cooling.com
Nextreme Thermal Solutions
San Jose, Calif., USA; 866-845-1197; www.nexlogic.com Durham, N.C., USA; 919-597-7300; www.nextreme.com
ITW Vortec
Sapa Extrusions - North America 9600 Bryn Mawr Ave., Rosemont, IL 60018 USA; 412-9964872; Stephen Jackson, Stephen.Jackson@sapagroup.com; www.sapagroup.com
Cincinnati, Ohio, USA; 800-441-7475; www.vortec.com
J J. Kittredge Division of Niagara Thermal Products, 18 Bonazzoli Ave., Hudson, MA 01749; 978-567-0998; Fax: 978-567-0796; sales@kittredge.com
Niagara Thermal Products 3315 Haseley Drive, Niagara Falls, NY 14304 USA; 716-2970652; Fax: 716-297-2550; sales@niagarathermal.com; www.niagarathermal.com
Find updated listings at www.electronics-cooling.com
Electronics COOLING
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Electronics COOLING 2012 Buyers' Guide: Company Directory Schlegel Electronic Materials
STEGO, Inc.
Thermshield LLC
Rochester, N.Y., USA; 585-643-2000; www.schlegelemi.com
Marietta, Ga., USA; 770-984-0858; www.stegousa.com
SCTB NORD
Stockwell Elastomerics, Inc.
Moscow, Russia; +7 499 3576771; www.sctbnord.com
Philadelphia, Pa., USA; 215-335-3005; www.stockwell.com
Division of Niagara Thermal Products, PO Box 1641, Laconia, NH 03247 USA; 603-524-3714; info@thermshield.com; www.thermshield.com
Seifert Electronic GmbH & Co. KG
Summit Thermal System Co., Ltd...........................34
Ennepetal, Germany; +49 2333 79060; www.seifert-electronic.de
Shin-lan Sec, Humen Town, Dong Guan, Guang Dong, P.R. China, 523917; 86-769-8862-3990; Fax: 86-769-8862-3998; sales@summit.heat-sink.com.tw; www.heat-sink.com.tw
Sensor Products Inc. Madison, N.J., USA; 973-428-8985; www.sensorprod.com
SUNON Inc.....................................................................3
SEPA EUROPE GmbH
1075 W. Lambert Road, Unit A, Brea, CA 92821-2944 USA; 714-255-0208; Fax: 714-255-0802; info@sunon.com; www.sunonamerica.com
Freiburg, Germany; +49 761 3842273 0; www.sepa-europe.com
ShinEtsu MicroSi Phoenix, Ariz., USA; 888-642-7674; www.microsi.com
Singapore Institute of Manufacturing Technology Singapore; +65 6793 8361; http://liquidforging.simtech. a-star.edu.sg
SinkPAD Corporation Placentia, Calif., USA; 714-660-2944; www.sinkpad.com
Smart Heatsinks Davie, Fla., USA; 954-840-3256; www.smartheatsinks.com
SNS Cooling Technology Inc. Ontario, Canada; 416-738-7797; www.snscoolingtech.com
sp3 Diamond Technologies, Inc. Santa Clara, Calif., USA; 408-492-0630; www.sp3diamondtech.com
Spectra-Mat, Inc. Member of SAES Getters Group, 100 Westgate Drive, Watsonville, CA 95076 USA; 831-722-4116; Fax: 831-722-4172; www.saes-smi-tmsolutions.com
Spectrum Sensors St Marys, Pa., USA; 814-834-1541; www.specsensors.com
Surmet Corporation Burlington, Mass., USA; 781-345-5727; www.surmet.com
T
Timtronics 35 Old Dock Road, Yaphank, NY 11980 USA; 631-345-6509; Prakash Khatri, info@timtronics.com; www.timtronics.com
TTM Co., Ltd. Chungcheongnam-do Korea; +82-31-888-9258; www.coolttm.com
U Universal Air Filter Company
Taica Corporation Tokyo, Japan; 81-3-6367-6624; www.taica.co.jp/english/ index.html
TE Technology, Inc. Traverse City, Mich., USA; 231-929-3966; www.tetech.com
Temperature@lert
Sauget, Ill., USA; 618-271-7300; www.uaf.com
V Vette Corp. Portsmouth, N.H., USA; 508-804-5509; www.vettecorp.com
Verotec Inc.
Boston, Mass., USA; 866-524-3540; www.temperaturealert.com
Londonderry, N.H., USA; 603-821-9921; www.verotec.us
W
TES International LLC Troy, Mich., USA; 248-362-2090; www.tesint.com
Wakefield Solutions
Teseq
Pelham, N.H., USA; 603-635-2800; www.wakefield.com
Edison, N.J., USA; 732-225-9533; www.teseq.com
Waypoint Thermal Management, Inc. Montville, N.J., USA; 908-672-7362; Fax: 973-257-8999; www.waypointmanagement.com
Wolverine Tube Inc. - MicroCool Division
Thermacore, Inc. 780 Eden Road, Lancaster, PA 17601 USA; 717-569-6551; Fax: 717-569-8424; www.thermacore.com
Decatur, Ala., USA; 760-672-2567; Fax: 256-580-350; www.microcooling.com
Y Youthen Technology Co., Ltd.
Stablcor......................................................................... 19 17011 Beach Blvd., Suite 900, Huntington Beach, CA 92647 USA; 714-375-6644; Fax: 714-375-6699; Don Roy, donroy@stablcor.com; www.Stablcor.com
Staubli Corporation Duncan, S.C., USA; 864-433-1980; www.staubli.com
Thermal Engineering Associates, Inc. 3287 Kifer Road, Santa Clara, CA 95051-0826 USA; 650-9615900; Fax: 650-227-3814; www.thermengr.com
Thermal Solution Resources, LLC Narragansett, R.I., USA; 401-515-3269; www.thermsource.com
Thermal Solutions Inc.
GuangDong, China, 523921; 86-769-8161 9568; www.youthentec.cn
Z Zalman Tech Co., Ltd. Seoul, Korea; +82-2-2107-3232; www.zalman.co.kr
Ann Arbor, Mich., USA; 734-761-1956; www.thermalsoftware.com
Index of Advertisers Alpha Novatech, Inc..................... inside back cover AMETEK Rotron..........................................................33 The Bergquist Company...............inside front cover Cofan USA...................................................................32 Concept Group Inc.....................................................24 Deepcool Industries Co. Ltd.....................................17 ebm papst................................................... back cover Electronic Components and Technology Conference (ECTC)....................................................26 Electronics Cooling..............................................15, 34 Fischer Elektronik GmbH &Co. KG..........................30 FLIR Commercial Systems, Inc................................16 Fujipoly America Corp...............................................31
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Electronics COOLING March 2012
Future Facilities..........................................................27 Harley Thermal LLC...................................................18 Intermark USA............................................................27 Interference Technology..........................................21 Malico Inc.....................................................................9 Mentor Graphics........................................................29 Mintres BV..................................................................10 NMB Technologies....................................................13 PLANSEE SE.................................................................7 SEMI-THERM..............................................................23 Stablcor Technology, Inc..........................................19 Summit Thermal System Co., Ltd.............................34 Sunon Inc......................................................................3